Lead-Free Hot Air Reflow Oven

Lead-Free Hot Air Reflow Oven — Custom 8 or 10 Zone for Heat Sink & PCB Assembly

Production-grade lead-free hot air reflow oven with 8 or 10 independently controlled heating zones, ±1°C temperature accuracy, and a fully configurable spec: belt width, rail layout, N₂ atmosphere, cooling method, conveyor direction, and MES integration — all adjustable to match your production line.

Overview

The CT-RFO-LF is a horizontal hot-air convection reflow oven for lead-free soldering production. It handles both PCB solder paste reflow and heat sink / thermal module assembly, with a standard air atmosphere configuration and optional N₂ tunnel for copper-intensive applications. The core platform comes in 8-zone and 10-zone configurations; both share the same PID + SSR temperature control architecture, the same stainless steel inner tunnel, and the same SMEMA-compatible conveyor interface.

The distinguishing feature of this model is the depth of customization available. Belt width, rail count, conveyor direction, atmosphere control, cooling method, clearance height, power supply voltage, and MES integration level are all configurable before build — not afterthought options grafted onto a standard machine. This is the machine for production line designers who need a reflow station that slots cleanly into a specific cell layout and workflow.

The base configuration handles standard PCB assembly and aluminum heat sink soldering. The N₂ atmosphere upgrade extends it to copper radiators, AI server coolers, and EV power electronics, where oxide-free joints are required.

Standard Configuration — and What Can Be Changed

Below are the standard specs and the configurable dimensions. Everything in the “Extended / custom” column can be specified at order time with no increase in lead time beyond the baseline 60–90 days:

Note: OEM / white-label configurations (custom branding, recolored panels) available with no minimum order quantity for standard configurations. Contact us with your exact requirements.

Key Features

• 8 or 10 top + bottom independent heating zones — 16 or 20 PID + SSR controlled zones total; each zone set and monitored independently

• ±1°C zone temperature accuracy, ±1.5°C on PCB surface — cross-belt ΔT held by balanced top/bottom airflow and the small-circulation recirculating plate structure

• Conveyor speed 300–2000 mm/min, stepper motor driven, chain + mesh belt, stainless steel structure with durable chain guard

• Reinforced no-deformation design — special loading bracket prevents board or workpiece jamming; tunnel frame rated for continuous production

• Dual insulation design — surface temperature stays within 5°C of room temperature; normal operating power drops to 10–12 kW after warm-up

• N₂ atmosphere option — sealed tunnel with O₂ as low as 150 ppm at 20–22 m³/h consumption; suitable for copper heat sink and vapor chamber soldering

• Advanced cooling system — forced air with water cooling option; flux reclamation built-in; 10 m³/min exhaust

• Ball screw auto width adjustment — conveyor rails remain parallel through mechanical life; no manual shimming

• Windows-based HMI — fault alarms, multi-language interface, profile storage, remote monitoring via network port

• SMEMA standard communication — drops straight into automated production lines; optional MES / OPC-UA for data-driven factories

• ~95% recyclable chassis materials — stainless + aluminum frame construction; RoHS-compliant design

• Warm-up time ~30 min (8-zone) / ~35 min (10-zone) — practical for shift-start recovery without pre-heating overnight

Technical Specifications

Applications

Heat Sink Assembly for AI Server & Data Center

Copper and aluminum heat sinks with embedded heat pipes or vapor chambers. The standard air-atmosphere machine works for aluminum production; the N₂ option brings it to copper and tier-1 quality standards. Upstream: CNC skiving fin machine. Downstream: thermal performance test machine.

LED High-Power Lighting Heat Sinks

Aluminum heat sinks for high-bay, stadium, and automotive LED assemblies. High volume, cost-sensitive — the 8-zone air configuration at 800–1200 mm/min belt speed is typical for this segment.

EV Power Electronics

Inverter, traction motor controller, and onboard charger heat sinks. N₂ atmosphere and 10-zone configuration provide the joint quality automotive customers require. RoHS-compliant lead-free SAC305 process.

PCB and SMT Assembly

Standard SMEMA interface and Windows-based profile management make this oven fully compatible with automated PCB assembly lines. Suitable for mid-to-high-volume lead-free SMT production where a reliable, configurable oven is needed without the premium price of brands like Heller or BTU.

Telecom, Industrial, and Custom Applications

5G base station components, industrial power modules, medical electronics. The extended tunnel height option (up to 150 mm clearance) handles tall assemblies that a standard PCB oven cannot accommodate.

Why Choose Cooling Thermal

• Factory direct — no distribution markup. We manufacture the oven; you’re not paying a regional distributor’s margin.

• Custom before build, not after — belt width, zone count, atmosphere, rail layout, voltage, and MES integration specified at order time, built-in from day one.

• Thermal manufacturing ecosystem — we build heat pipe, vapor chamber, cold plate, and heat sink production equipment across the full line, so this oven can be sourced alongside the machines that feed it and follow it.

• OEM and white-label available — for equipment resellers, system integrators, and branded turnkey line suppliers.

• Engineer-led commissioning — on-site installation, profile validation on your actual parts, operator training, and 12-month warranty.